“The new capability of low thermal budget growth on an 8-inch scale enables the integration of this material with silicon CMOS technology and paves the way for its future electronics application.”
Their new process makes it possible to grow smooth and uniform layers across 8-inch wafers while significantly reducing the time required. This new method could be pivotal in commercial applications where wafers larger than 8 inches are typical.
Jiadi Zhu, electrical engineering and computer science graduate student and co-lead author of the paper, broke the technique down into simpler terms. “Using 2D materials is a powerful way to increase the density of an integrated circuit. What we are doing is like constructing a multistory building. If you have only one floor, it won’t hold many people. But with more floors, the building will hold more people that can enable amazing new things.
While molybdenum stays and decomposes at the front, where temperatures are below 752 degrees Fahrenheit, theOn decomposition, it flows back into the front and chemically reacts to grow molybdenum disulfide on the surface of the wafer. Zhu and the team now look to fine-tune their technique and explore similar processes to grow these layers into everyday surfaces like textiles andTwo-dimensional materials are promising candidates for future electronics due to their excellent electrical and photonic properties.
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