Researchers at Tsinghua University in China have developed a new lithography process to help boost the Chinese semiconductor industry.
To this end, some nations, like China, are working on ways to attempt to compete. And this is where researchers at Tsinghua University come into play. “One of the potential applications of our research is as a light source for future EUV lithography machines. I think this is why the international community is paying close attention,” explained project leader Professor Tang Chuanxiang from Tsinghua University.
When the EUV beam reaches the chip, it has already undergone reflection from 11 mirrors, which causes approximately a 30% energy loss at each point. Consequently, the beam's power is less than 5W when it finally reaches the wafer. This may become problematic as manufacturing advances to 3nm or 2nm.
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